Download Files
| Rohs Files | REACH Files | 2D DRAWING (PDF) | 3D CAD MODEL (STEP) |
|---|---|---|---|
| Download | Download | Download | Download |
Description
33mm BGA Roundpin Heatsink, Aluminum, 11.6mm Tall
| Part | Type | Material | Width (mm) | Length (mm) | Height (mm) | Theta SA @200LFM | Theta SA @400LFM | Theta SA @600LFM |
|---|---|---|---|---|---|---|---|---|
| INM33002-12P/2.6 | BGA | Aluminum | 33 | 33 | 11.6 | 3.46 | 2.25 | 1.66 |
The INM-P Series of aluminum round pin BGA Heatsinks are ideal for omni-directional air flow and convection environments. This Clipon Heatsink is designed for BGA chipsets and mounts with a EZ Snap™ clip that requires no special board modifications.
Use clip tool HS8132 to attach or remove heatsink assembly directly to BGA chip
