News

Opening New Horizons: the Matsuura MX-420 PC10 Radian’s machining division is excited to announce the acquisition of our latest high-performance equipment: the Matsuura MX-420 PC10. A Production Workhorse Capable of handling a 10 pallet work setup up to 175 lbs, which is 100 lbs more than the UMC500 AX5 pallet system, the MX-420 PC10 allows…

  We are pleased to present the following white paper that compares the predicted performance of two cold plate designs for a given liquid cooling system: 1. A four pass aluminium plate design with copper pipes 2. A water-immersed high-density fin array cold plates skived from a copper block CFD simulation was used to visualise…

  Originally published in Electronics Cooling  |  July 11, 2023 The millions of data centers worldwide require a significant amount of energy to function. This makes them not only very costly to operate, but also results in a substantial impact on the environment. Data Center Environmental Impact The environmental effects of all these data centers…

  Santa Clara—August 20, 2017—Radian Thermal Products, Inc. is pleased to announce the release of a new line of standard PCIe heatsinks. These PCIe heatsinks have been specifically designed and time tested on many PCI card applications. PCIe heatsinks are also useful for other low profile applications. We offer pushpin, stick-on, screw, and BGA EZ-Snap heatsink…

  Santa Clara—July 28, 2017—Radian Thermal Products, Inc. is pleased to announce the release of a new white paper on the performance of E-Coated Heatsinks where we compare thermal performance compared to an Anodized Heatsink. Visit Page   https://radianheatsinks.com/radian-heatsinks/heatsink/e-coated-heatsink/   Radian Thermal Products, Inc., headquartered in Santa Clara, California, was founded in 1974 as a…

  Until recently, Moore’s Law, the observation that the number of transistors on a microchip doubles every two years, seemed a self-fulfilling prophecy. When Intel co-founder Gordon Moore issued his famous prediction 40 years ago, a chip could hold a few dozen transistors. Today’s technology can cram almost 1 billion transistors, each of which is…

No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability, Performance No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability and Performance. Radian Heatsinks, a division of Intricast Company, Inc., today unveiled a new line of removable BGA fansinks. To meet growing demands for enhanced cooling efficiencies in high-power, high-density component packages, these off-the-shelf…

Intricast Company, Inc., today announced the formation of a new Division, Radian Heatsinks (formerly Intricast Heatsink Division), to better serve the electronics industry. Radian Heatsinks designs and manufactures high performance heatsinks, specializing in producing standard and custom heatsinks. Radian Heatsink Division is located in the Intricast Company Santa Clara, California headquarters to provide customers a…

  ATLANTA – June 4, 2001 – Radian Heatsinks, a Division of Intricast Company, today announced the introduction of its Removable BGA heatsinks and Fan sink product lines. On display in Booth #9023, the BGA product line will demonstrate the unique EZ Snap™ clip design of its high performance heatsinks. The removable BGA heatsinks come…