Thermal Interface Material or TIM is the interface between a heatsink, and a device. Thermal adhesive or thermal grease improve the heat sink’s performance by filling air gaps between the heat sink and the heat spreader on the device. Radian Thermal offers a wide selection of thermal interface pads to provide both an attachment method and improved thermal transfer. These phase-change Thermal Interface Materials (TIMs) are designed to completely fill interfacial air gaps and voids, displacing entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) – less than 0.001 inch or 0.0254mm, and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path. At room temperature, the materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. With light clamping pressure it will readily conform to both mating surfaces.