Ultra-thin vapor chambers (UTVCs) are advanced thermal management devices used primarily in electronics to efficiently dissipate heat. They are designed with a thin profile to efficiently fit compact electronics that require unobstrisive thermal management systems without compromising on space. Ultra-thin vapor chambers can fit seamlessly into rigid designs with limited space to ensure consistent cooling and enabling devices to operate at their optimum levels without overheating.
HEATSINK TECHNOLOGY
ULTRA-THIN VAPOR CHAMBERS / THIN VAPOR CHAMBERS
WHAT ARE ULTRA-THIN VAPOR CHAMBERS?
Ultra-Thin Vapor Chambers can effectively manage heat distribution in systems where space is a premium and a compact cooling system is a prerequisite. Radian’s ultra-thin vapor chambers increases the design thanks to its sleek profile by allowing for extra battery space or creating a more streamlined product, hence saving on material cost.
ULTRA-THIN VAPOR CHAMBER EXAMPLES
CHARACTERISTICS
- Design: Ultra-thin vapor chambers are typically less than 0.4 mm thick. They are made from materials such as copper or aluminum, which have high thermal conductivity.
- Structure: They consist of a sealed chamber containing a small amount of liquid coolant. The chamber is lined with a wick structure that helps in the capillary movement of the fluid.
- Size: These chambers can be designed in various shapes and sizes, making them versatile for different applications in compact electronic devices.
FEATURES
- Heat Absorption: When heat is applied to one side of the vapor chamber, the liquid inside vaporizes, absorbing the heat energy.
- Vapor Movement: The vapor then travels to cooler regions of the chamber, where it condenses back into a liquid, releasing the absorbed heat.
- Heat Distribution: The wick structure helps spread the heat evenly across the entire surface of the chamber, preventing hotspots.
- Cycle Continuation: The liquid returns to the heated side through capillary action, allowing the cycle to continue efficiently.
APPLICATIONS
- Consumer Electronics: Ultra-thin vapor chambers are commonly used in smartphones, laptops, and tablets to manage heat from processors and GPUs.
- High-Performance Computing: They are utilized in servers and workstations where high thermal loads are present.
- Automotive: They can be found in electric vehicles to manage heat from battery packs and power electronics.
- Telecommunications: Used in data centers OSFP/QSFP to cool high-density server application.
BENEFITS
- Efficient Heat Dissipation: Vapor chambers provide superior thermal performance compared to traditional heat sinks, especially in compact designs.
- Space-Saving: Their ultra-thin profile allows for integration into slim devices without adding significant bulk.
- Improved Reliability: By effectively managing heat, vapor chambers can enhance the reliability and longevity of electronic components.
- Design Flexibility: They can be customized to fit specific design requirements, accommodating various thermal loads and form factors.
CHALLENGES
- Manufacturing Complexity: The production of ultra-thin vapor chambers can be more complex than traditional cooling solutions.
- Cost: They may be more expensive due to the materials and manufacturing processes involved.
- Material Limitations: The performance can be affected by the choice of working fluid and the materials used for the chamber.
IN SUMMARY
Ultra-thin vapor chambers represent a significant advancement in thermal management technology, particularly suitable for modern electronics that demand efficient cooling solutions in increasingly compact designs. As technology continues to advance, their role in thermal management systems is expected to grow, addressing the challenges of heat dissipation in various applications.
THIN VAPOR CHAMBERS
Our Thin Vapor Chamber is designed for slightly larger applications where high performance is still crucial but where additional thickness is acceptable. These chambers provide an expanded surface area that enhances thermal performance while maintaining a lightweight profile.
The main difference between ultra-thin and thin vapor chambers lies in their thickness and the resulting impact on their heat transfer performance. Thin vapor chambers have a thickness ranging from 0.4 mm to 1 mm and are also designed for applications where space is limited, but not to the same extent as ultra-thin vapor chambers. Thin vapor chambers can provide high heat transfer rates and are often used in portable electronic devices, such as laptops and tablets. They can be made with various materials, including copper, stainless steel, and titanium, each with its own strengths and weaknesses.
THIN VAPOR CHAMBER EXAMPLES
CHARACTERISTICS
- Thickness: Thin vapor chambers typically range from about 1 mm to a few millimeters in thickness, making them suitable for applications where space is limited.
- Materials: Commonly made from high thermal conductivity metals like copper or aluminum, which enhance heat transfer efficiency.
- Wick Structure: They include a porous wick structure that facilitates liquid movement through capillary action, crucial for the vaporization-condensation cycle.
- Sealed Chamber: The chamber is evacuated and sealed, filled with a small amount of working fluid (usually water or other refrigerants).
OPERATING PRINCIPLE
- Heat Absorption: When heat is applied to one side, the fluid within the chamber vaporizes, absorbing heat energy and cooling the surface.
- Vapor Transport: The vapor moves to cooler areas of the chamber, where it condenses back into a liquid, releasing the absorbed heat.
- Capillary Action: The wick structure allows the condensed liquid to return to the heated area, enabling continuous operation.
- Uniform Heat Distribution: The design ensures that heat is evenly spread across the surface, preventing localized overheating.
APPLICATIONS
- Consumer Electronics: Widely used in smartphones, laptops, and tablets to manage heat from CPUs and GPUs.
- High-Performance Computing: Essential in servers and workstations that handle intensive processing loads.
- Automotive: Employed in electric vehicles for cooling battery packs and power electronics, as well as in traditional vehicles for engine cooling.
- Telecommunications: Used in data centers to efficiently cool high-density server configurations.
- LED Lighting: Helps manage heat in high-output LED applications, improving efficiency and lifespan.
ADVANTAGES
- High Thermal Conductivity: Thin vapor chambers can dissipate heat more effectively than traditional heat sinks, ensuring components operate within safe temperature ranges.
- Compact Design: Their slim profile allows for integration into tight spaces, making them ideal for modern electronic devices.
- Enhanced Reliability: By maintaining optimal operating temperatures, they improve the lifespan and reliability of electronic components.
- Scalability: Can be tailored to various sizes and thermal loads, providing flexibility in design.
- Low Weight: Lightweight compared to traditional cooling methods, which is beneficial for portable devices.
CHALLENGES
- Manufacturing Complexity: The production process can be intricate, requiring precision to ensure effective functioning.
- Cost: They may be more expensive than conventional heat sinks due to the materials and manufacturing techniques involved.
- Fluid Limitations: The choice of working fluid can impact performance and efficiency, and certain fluids may have environmental or regulatory concerns.
- Orientation Sensitivity: Some designs may have performance limitations based on orientation, which can affect their use in multi-directional applications.
CONCLUSION
Thin vapor chambers are a critical technology in thermal management, especially as electronic devices continue to shrink in size while increasing in performance. Their ability to efficiently manage heat in compact formats makes them indispensable in a variety of industries, from consumer electronics to automotive applications. As technology evolves, ongoing research and development will likely enhance their performance and broaden their application scope.
Radian takes pride in its innovative approach to thermal management solutions. Our Ultra Thin Vapor Chambers and Thin Vapor Chambers are designed to meet the ever-evolving demands of modern technologies requiring more efficient cooling solutions.
DESIGN GUIDELINES
The following table shows the suggested operation conditions for typical applications. They are not necessarily the maximum capabilities of vapor chambers.
| Ultra-Thin Vapor Chamber Ambient temperature | 0 - 85 ºC |
| Power | 5 - 700 W |
| Heat Flux | Up to 300 W/cm^2 |
| Size (width and length) | 50 to 500 mm |
| Vapor Chamber Thickness | 0.8 mm and up |
| Vapor Chamber Flatness | 0.1 mm in every 25x25 mm area |
| Vapor Chamber Life (MTBF) | 100,000+ hours |
| Through Holes | Allowed |
THIN VAPOR CHAMBERS
| Product Code | Description | Material | Power(W) | Surface treatment | Thickness (mm) | Length (mm) | Width (mm) |
|---|---|---|---|---|---|---|---|
| VC-8 | Thin VC | Cu C5191 | 8 | Antioxidant | 0.85 | 123.00 | 52.00 |
| VC-9 | Thin VC | Cu C5191 | 8 | Plating | 0.85 | 136.50 | 60.00 |
| VC-10 | Thin Heat Sink | CU1100+AL1050 | 6 | Antioxidant | 2.8 | 55.00 | 12.50 |
| VC-11 | Thin VC | Cu C5191 | 6 | Antioxidant | 1 | 60.00 | 20.00 |