PCIe Heatsink Solutions

Scaleflux offers the ability to integrate compute engines with a high capacity Flash storage that is connected through PCIe. This innovative product dramatically increases the processing efficiency of compute-intensive functions.

Through a consultative design process we were able to meet the demands of this tough thermal environment by manufacturing a clear anodized heatsink that includes extruding, die-casting, and silk screening processes.

Our customer was designing a PCIe Card and required a low-cost solution that would both cool their chip sets and provide mechanical support of their card.

Using advanced Mechanical Design Thermal Simulation technologies, Radian quickly designed a heatsink to meet the mechanical stresses and thermal management requirements of the application.  The end result is a low-cost aluminum plate fin heatsink with a milled baseplate to provide best thermal mating to the chip sets being cooled while providing appropriate clearance for all other supporting components.

Our customer was designing a high-end PCIe Add-on Card with a great deal of processing power and needed a low-profile thermal management solution with a low-profile to avoid conflict with other Add-on cards and not disrupt typical airflow from a wide array of possible installations.  We designed a one-piece copper heatsink that provided both thermal dissipation and mechanical support for the PCIe Card.

Customer had 3 chips on the board, that needed heatsink cooling, dissipating 26W. Customer had 300 LFM of airflow.

Using advanced thermal analysis we designed a low-cost aluminum heatsink solution. We separated the heatsinks to minimize any bend, twist of the PCB. The Heatsinks are affixed with plastic pushpins.