As computing power scales exponentially, so does the heat generated by processors, GPUs, and dense power electronics. Air cooling — though reliable — reaches its practical limits when component power densities exceed what convection alone can manage.
Radian Thermal Products designs and manufactures liquid cooling systems and cold plate assemblies engineered to handle the most demanding thermal loads across AI, HPC, and industrial applications.
The Growing Thermal Challenge in High-Density Environments
As component thermal densities increase due to the rapid adoption of Artificial Intelligence (AI), Machine Learning (ML) and High Performance Computing (HPC); where GPUs, FPGAs and multi-core CPUs are pushing well beyond traditional thermal envelopes.
Liquid cooling provides up to 5x to 10x higher heat transfer efficiency than air cooling, ensuring consistent performance even under continuous workloads. Key Drivers:
Direct-to-Chip (Cold Plate) Liquid Cooling
Direct-to-chip systems use Liquid Cold Plates mounted directly to processors, GPUs or power devices. A closed-loop fluid circuit transfers heat through a thermally conductive interface, maintaining consistent temperature across each component.
Key Components:
This architecture is ideal for dense computing environments where thermal loads are localized and airflow paths are constrained.
Enhancing Performance and Longevity
Liquid cooling enables tighter thermal control, reducing temperature fluctuations that degrade component life and stability.
Reducing Energy Consumption
In large-scale facilities, liquid cooling can significantly lower total power consumption by reducing dependence on high-CFM fans and air-handling units.
Liquid Cooling Technology for High Performance
Radian provides custom and standard liquid cooling solutions optimized for the most demanding thermal management applications using turnkey systems that integrate; Cold Plates, Manifolds, Pumps and Control Electronics designed for seamless OEM integration.
Liquid Cold Plates
Liquid Cooling Solutions
As computing power scales exponentially, so does the heat generated by processors, GPUs, and dense power electronics. Air cooling — though reliable — reaches its practical limits when component power densities exceed what convection alone can manage.
Radian Thermal Products designs and manufactures liquid cooling systems and cold plate assemblies engineered to handle the most demanding thermal loads across AI, HPC, and industrial applications.
As component thermal densities increase due to the rapid adoption of Artificial Intelligence (AI), Machine Learning (ML) and High Performance Computing (HPC); where GPUs, FPGAs and multi-core CPUs are pushing well beyond traditional thermal envelopes.
Liquid cooling provides up to 5x to 10x higher heat transfer efficiency than air cooling, ensuring consistent performance even under continuous workloads. Key Drivers:
Direct-to-chip systems use Liquid Cold Plates mounted directly to processors, GPUs or power devices. A closed-loop fluid circuit transfers heat through a thermally conductive interface, maintaining consistent temperature across each component.
Key Components:
This architecture is ideal for dense computing environments where thermal loads are localized and airflow paths are constrained.
Liquid cooling enables tighter thermal control, reducing temperature fluctuations that degrade component life and stability.
In large-scale facilities, liquid cooling can significantly lower total power consumption by reducing dependence on high-CFM fans and air-handling units.
Radian provides custom and standard liquid cooling solutions optimized for the most demanding thermal management applications using turnkey systems that integrate; Cold Plates, Manifolds, Pumps and Control Electronics designed for seamless OEM integration.
Liquid Cold Plates
Liquid Cooling Solutions
