Liquid Cold Plates: Enabling the Next Generation of High-Density ElectronicsAs electronic systems continue to evolve toward higher power density and greater functional complexity, thermal management has become a defining factor in system performance and reliability. Across AI data centers, semiconductor equipment, defense and aerospace platforms, power electronics, and industrial systems, engineers are increasingly required to…
The Critical Role of Advanced Thermal Cooling Solutions for CPU DemandThe rapid acceleration of artificial intelligence workloads is reshaping the architecture of modern compute infrastructure. While much of the early attention in AI systems has focused on GPUs, there is a clear and growing inflection point where server CPUs are re-emerging as a critical pillar…
Optical Application for Data & Telecoms The increased use of transceivers and co-packaged optics in datacenters is driven by the growing demand for network bandwidth and data processing speeds. The integration of optical fiber cables is rapidly transforming data center infrastructure The drive for increased performance has resulted in an exponential rise in power…
Opening New Horizons: the Matsuura MX-420 PC10 Radian’s machining division is excited to announce the acquisition of our latest high-performance equipment: the Matsuura MX-420 PC10. A Production Workhorse Capable of handling a 10 pallet work setup up to 175 lbs, which is 100 lbs more than the UMC500 AX5 pallet system, the MX-420 PC10 allows…
We are pleased to present the following white paper that compares the predicted performance of two cold plate designs for a given liquid cooling system: 1. A four pass aluminium plate design with copper pipes 2. A water-immersed high-density fin array cold plates skived from a copper block CFD simulation was used to visualise…
Originally published in Electronics Cooling | July 11, 2023 The millions of data centers worldwide require a significant amount of energy to function. This makes them not only very costly to operate, but also results in a substantial impact on the environment. Data Center Environmental Impact The environmental effects of all these data centers…
Vapor chamber cooling is a highly efficient thermal management solution used in electronic devices and high-performance computers to dissipate heat generated by the components. It is a flat, sealed chamber filled with a small amount of liquid (de-ionized water) that evaporates when exposed to heat. The vaporized liquid then spreads out evenly across the…
Santa Clara—August 20, 2017—Radian Thermal Products, Inc. is pleased to announce the release of a new line of standard PCIe heatsinks. These PCIe heatsinks have been specifically designed and time tested on many PCI card applications. PCIe heatsinks are also useful for other low profile applications. We offer pushpin, stick-on, screw, and BGA EZ-Snap heatsink…
