What is Thermal Management?As modern electronic devices grow more compact and processing demands reach new heights, controlling internal system temperatures has become a critical engineering priority. Thermal Management is the strategic application of thermodynamics to regulate, dissipate, and transfer excess heat away from sensitive electronic components. For 50+ years, Radian Thermal Products Inc. has designed…
Skived vs Extruded Heatsink: Choosing the Right Manufacturing ProcessSelecting the optimal thermal management component requires a careful evaluation of thermal performance, material constraints, and manufacturing economics. For engineering teams evaluating high-surface-area air cooling, the decision often comes down to a choice between a skived fin heatsink and an extruded heatsink. Because Radian Thermal Products designs…
What is Computational Fluid Dynamics (CFD)?Computational Fluid Dynamics (CFD) is a specialized branch of fluid mechanics that uses numerical analysis and data structures to analyze and solve problems involving fluid flows. In thermal management, CFD simulation acts as a virtual wind tunnel or fluid loop. It is widely used to evaluate and optimize diverse cooling…
Liquid Cold Plates: Enabling the Next Generation of High-Density ElectronicsAs electronic systems continue to evolve toward higher power density and greater functional complexity, thermal management has become a defining factor in system performance and reliability. Across AI data centers, semiconductor equipment, defense and aerospace platforms, power electronics, and industrial systems, engineers are increasingly required to…
The Critical Role of Advanced Thermal Cooling Solutions for CPU DemandThe rapid acceleration of artificial intelligence workloads is reshaping the architecture of modern compute infrastructure. While much of the early attention in AI systems has focused on GPUs, there is a clear and growing inflection point where server CPUs are re-emerging as a critical pillar…
Optical Application for Data & Telecoms The increased use of transceivers and co-packaged optics in datacenters is driven by the growing demand for network bandwidth and data processing speeds. The integration of optical fiber cables is rapidly transforming data center infrastructure The drive for increased performance has resulted in an exponential rise in power…
Opening New Horizons: the Matsuura MX-420 PC10 Radian’s machining division is excited to announce the acquisition of our latest high-performance equipment: the Matsuura MX-420 PC10. A Production Workhorse Capable of handling a 10 pallet work setup up to 175 lbs, which is 100 lbs more than the UMC500 AX5 pallet system, the MX-420 PC10 allows…
We are pleased to present the following white paper that compares the predicted performance of two cold plate designs for a given liquid cooling system: 1. A four pass aluminium plate design with copper pipes 2. A water-immersed high-density fin array cold plates skived from a copper block CFD simulation was used to visualise…
