Vapor chamber cooling is a highly efficient thermal management solution used in electronic devices and high-performance computers to dissipate heat generated by the components. It is a flat, sealed chamber filled with a small amount of liquid (de-ionized water) that evaporates when exposed to heat. The vaporized liquid then spreads out evenly across the chamber,…
Thermal analysis or Thermal simulation of a heatsink is important to predict its effectiveness in cooling devices and prevent overheating. By conducting a thermal analysis, engineers can optimize the design of a heatsink to enhance its heat dissipation capabilities. Thermal analysis typically involves using first principle-based hand calculation and simulation software used in combination to…
Santa Clara—August 20, 2017—Radian Thermal Products, Inc. is pleased to announce the release of a new line of standard PCIe heatsinks. These PCIe heatsinks have been specifically designed and time tested on many PCI card applications. PCIe heatsinks are also useful for other low profile applications. We offer pushpin, stick-on, screw, and BGA EZ-Snap heatsink versions.…
Santa Clara—July 28, 2017—Radian Thermal Products, Inc. is pleased to announce the release of a new white paper on the performance of E-Coated Heatsinks where we compare thermal performance compared to an Anodized Heatsink. Visit Page E-coated Heatsink Radian Thermal Products, Inc., headquartered in Santa Clara, California, was founded in 1974 as a premium…
Until recently, Moore’s Law, the observation that the number of transistors on a microchip doubles every two years, seemed a self-fulfilling prophecy. When Intel co-founder Gordon Moore issued his famous prediction 40 years ago, a chip could hold a few dozen transistors. Today’s technology can cram almost 1 billion transistors, each of which is less…
Ultra Efficient Cooling Solutions for the Latest Intel® 3.4GHz and 3.6GHz Prescott Processors Radian Heatsinks, a division of Intricast Company, Inc., today announced the release of a new range of high efficiency coolers specifically designed to accommodate the rigorous cooling demands of the newest Intel® Pentium® 4 Prescott processors. Currently, there are two fansink assemblies…
No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability, Performance No-Fuss Cooling Solutions Empower Compact ICs with Extended Reliability, Affordability and Performance. Radian Heatsinks, a division of Intricast Company, Inc., today unveiled a new line of removable BGA fansinks. To meet growing demands for enhanced cooling efficiencies in high-power, high-density component packages, these off-the-shelf…
June 4, 2003 – Radian Heatsinks, a Division of Intricast Company, today announced the introduction of its DC/DC Converter Heatsinks. On display in Booth #9023, the DC/DC product line will be displayed, including the Round Pin (“Icicle”) and Plate Fin (“Black Ice”) Series products. “Our Round Pin Heatsinks are best used when the direction of…
