Download Files
| Rohs Files | REACH Files | 2D DRAWING (PDF) | 3D CAD MODEL (STEP) |
|---|---|---|---|
| Download | Download | Download | Download |
Description
37.5mm BGA Roundpin Heatsink, Aluminum, 14.6mm Tall
| Part | Type | Material | Width (mm) | Length (mm) | Height (mm) | Theta SA @200LFM | Theta SA @400LFM | Theta SA @600LFM |
|---|---|---|---|---|---|---|---|---|
| INM37.5002-25P/2.6 | BGA | Aluminum | 37 | 37 | 14.6 | 2.83 | 1.78 | 1.23 |
The INM-P Series of aluminum round pin BGA Heatsinks are ideal for omni-directional air flow and convection environments. This Clipon Heatsink is designed for BGA chipsets and mounts with a EZ Snap™ clip that requires no special board modifications.
Use clip tool HS8132 to attach or remove heatsink assembly directly to BGA chip
Additional Information
| Weight | 0.0204 lbs |
|---|---|
| Dimensions | 37 × 37 × 14.6 cm |
| Material | |
| Height (mm) | |
| Style | |
| Size |
