The round-pin heatsink was developed for low air flow environments. The round shaped pins are set in a pattern that makes it easier for air to efficiently flow through the heat sink. A round-pin heatsink is ideal for omni-directional situations as the airflow can come from any direction, changes in airflow patterns only have a minimum impact on performance. Round-pin heatsinks provide a more effective cooling mechanism by fanning out of the heatsink fins within a given space environment, to dissipate heat at much higher rates in areas of low ventilation, compared to a normal flat fin heatsink.
Round-pin heatsinks can be manufactured from both aluminum and copper by various methods. The most efficient Round-pin heatsinks are cold-forged which allow for both high aspect ratio designs, and also highly conductive materials to optimize the heatsink for highly demanding thermal environments.
Radian Thermal Products offers a wide range of copper and aluminum round-pin heatsinks in both standard and custom designs. Many engineers are now using round-pin heatsinks in innovative ways to efficiently deal with challenging thermal requirements.
EZ Snap Mounting Clips are design specifically for processors and ball grid array (BGA) components. The clips attach the BGA Round-pin heatsink directly to the BGA component making use of the gap created by the ball grid array (BGA) between the component underside and PCB top surface. Therefore, the EZ Snap™ clips require no holes or modifications to the PCB. They also allow for easy rework of components with fast and easy installation and removal.
When selecting the correct clip, it is important to get a clip that is within the range of the nominal chip height. This is the chip height without the solder balls. If the nominal is not available on the chip datasheet just use (max + min)/2. Where a particular chip height is not available, the base of the BGA heatsink can be reduced to provide correct fitment. If there are any issues please contact our team to verify fitment size.
